Fujitsu P4X-0036-2M-800L Datasheet Page 23

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Intel® Xeon™ Processor with 800 MHz System Bus
Datasheet 23
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processors. These specifications are based on silicon
characterization, however they may be updated as further data becomes available. Listed frequencies are not necessarily
committed production frequencies.
2. Individual processor VID values may be calibrated during manufacturing such that two devices at the same speed may have
different VID settings.
3. These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is
required. See Section 2.4 for more information.
4. The voltage specification requirements are measured across vias on the platform for the VCCSENSE and VSSSENSE pins
close to the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 M minimum
impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system
is not coupled in the scope probe.
5. Refer to Table 10 and corresponding Figure 4. The processor should not be subjected to any static V
CC
level that exceeds the
V
CC_MAX
associated with any particular current. Failure to adhere to this specification can shorten processor lifetime.
6. Minimum V
CC
and maximum I
CC
are specified at the maximum processor case temperature (T
CASE
) shown in Table 23.
I
CC_MAX
is specified at the relative V
CC_MAX
point on the V
CC
load line. The processor is capable of drawing I
CC_MAX
for up to
10 ms. Refer to Figure 2 for further details on the average processor current draw over various time durations.
Table 9. Voltage and Current Specifications
Symbol Parameter Min Typ Max Unit Notes
1
VID range VID range for Intel® Xeon™
processor with 800 MHz system bus
1.2875 1.4000 V 2,3
V
CC
V
CC
for Intel® Xeon™ processor
with 800 MHz system bus FMB
processor
See Table 10 and
Figure 4
VID - I
CC
(max) * 1.25 m V 3, 4, 5, 6, 7
VID
Transition
VID step size during a transition ±12.5 mV 8
Total allowable DC load line shift
from VID steps
450 mV 9
V
TT
Front Side Bus termination voltage
(DC specification)
1.176 1.20 1.224 V 10
Front Side Bus termination voltage
(AC & DC specification)
1.140 1.20 1.260 V 10, 11
I
CC
I
CC
for Intel® Xeon™ processor with
800 MHz system bus with multiple
VIDs
2.80 - 3.60 GHz
FMB
100
120
A
A
6, 19
6, 7, 20
I
TT
Front Side Bus end-agent V
TT
current
4.8 A 12
I
TT
Front Side Bus mid-agent V
TT
current
1.5 A 13
I
CC_VCCA
I
CC
for PLL power pins 120 mA 14
I
CC_VCCIOPLL
I
CC
for PLL power pins 100 mA 14
I
CC_GTLREF
I
CC
for GTLREF pins 200 µA 15
I
SGNT
I
SLP
I
CC
Stop Grant for Intel® Xeon™
processor with 800 MHz system bus
2.80 GHz - FMB
50
A7,16
I
TCC
I
CC
TCC Active I
CC
A17
I
CC_TDC
I
CC
for Intel® Xeon™ processor with
800 MHz system bus
Thermal Design Current
2.80 - 3.60 GHz
FMB
85
105
A
A
18,19
7,18,20
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