Fujitsu P4X-0036-2M-800L Datasheet download pdf (Page 31)

Intel® Xeon™ Processor with 800 MHz System Bus

Datasheet 31

3.0 Mechanical Specifications

The Intel® Xeon™ processor with 800 MHz system bus is packaged in Flip Chip Micro Pin Grid

Array (FC-mPGA4) package that interfaces to the baseboard via an mPGA604 socket. The

package consists of a processor core mounted on a substrate pin-carrier. An integrated heat

spreader (IHS) is attached to the package substrate and core and serves as the mating surface for

processor component thermal solutions, such as a heatsink. Figure 6 shows a sketch of the

processor package components and how they are assembled together. Refer to the mPGA604

Socket Design Guidelines for complete details on the mPGA604 socket.

The package components shown in Figure 6 include the following:

1. Integrated Heat Spreader (IHS)

2. Processor die

3. Substrate

4. Pin side capacitors

5. Package pin

6. Die Side Capacitors

NOTE: This drawing is not to scale and is for reference only. The mPGA604 socket is not shown.

3.1 Package Mechanical Drawings

The package mechanical drawings are shown in Figure 7 and Figure 8. The drawings include

dimensions necessary to design a thermal solution for the processor. These dimensions include:

1. Package reference and tolerance dimensions (total height, length, width, etc.)

2. IHS parallelism and tilt

3. Pin dimensions

4. Top-side and back-side component keepout dimensions

5. Reference datums

6. All drawing dimensions are in mm [in.].

Figure 6. Processor Package Assembly Sketch

1 2 ... 26 27 28 29 30 31 32 33 34 35 36 ... 95 96

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Fujitsu P4X-0036-2M-800L Datasheet Page 31