Fujitsu P4X-0036-2M-800L Datasheet download pdf (Page 92)

Intel® Xeon™ Processor with 800 MHz System Bus

92 Datasheet

8.4 Thermal Specifications

This section describes the cooling requirements of the heatsink solution used by the boxed

processor.

8.4.1 Boxed Processor Cooling Requirements

As previously stated the boxed processor will be available in three product configurations. Each

configuration will require unique design considerations. Meeting the processor’s temperature

specifications is also the function of the thermal design of the entire system, and ultimately the

responsibility of the system integrator. The processor temperature specifications are found in

Section 6.0 of this document.

8.4.1.1 1U Passive CEK Heatsink (1U form factor)

In the 1U configuration it is assumed that a chassis duct will be implemented to provide 15 CFM of

airflow to pass through the heatsink fins. The duct should be designed as precisely as possible and

should not allow any air to bypass the heatsink (0” bypass) and a back pressure of 0.38 in. H

O. It

is assumed that a 40 °C T

is met. This requires a superior chassis design to limit the T

RISE

at or

below 5 °C with an external ambient temperature of 35 °C. Following these guidelines will allow

the designer to meet thermal profile B and conform to the thermal requirements of the processor.

8.4.1.2 2U Passive CEK Heatsink (2U and above form factor)

Once again a chassis duct is required for the 2U passive heatsink. In this configuration Thermal

Profile A (see Section 6.0) should be followed by supplying 22 CFM of airflow through the fins of

the heatsink with a 0” or no duct bypass and a back pressure of 0.14 in. H

O. The T

temperature

of 40 °C should be met. This may require the use of superior design techniques to keep T

RISE

at or

below 5 °C based on an ambient external temperature of 35 °C.

8.4.1.3 2U+ Active CEK Heatsink (2U+ and above pedestal)

This heatsink was designed to help pedestal chassis users to meet the thermal processor

requirements without the use of chassis ducting. It may

be necessary to implement some form of

chassis air guide or air duct to meet the T

temperature of 40 °C depending on the pedestal

chassis layout. Also, while the active heatsink solution is designed to mechanically fit into a 2U

chassis, it may require additional space at the top of the heatsink to allow sufficient airflow into the

heatsink fan. Therefore, additional design criteria may need to be considered if this heatsink is used

in a 2U rack mount chassis, or in a chassis that has drive bay obstructions above the inlet to the fan

heatsink.

Thermal Profile A should be used to help determine the thermal performance of the platform.

Once again it is recommended that the ambient air temperature outside of the chassis be kept at or

below 35 °C. The air passing directly over the processor heatsink should not be preheated by other

system components. Meeting the processor’s temperature specification is the responsibility of the

system integrator.

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