Fujitsu P4X-0036-2M-800L Datasheet download pdf (Page 81)

Intel® Xeon™ Processor with 800 MHz System Bus

Datasheet 81

NOTES:

1. The heatsink in this image is for reference only, and may not represent any of the actual boxed processor

heatsinks.

2. The screws, springs, and standoffs will be captive to the heatsink. This image shows all of the components in

an exploded view.

3. It is intended that the CEK spring will ship with the baseboard and be pre-attached prior to shipping.

8.2 Mechanical Specifications

This section documents the mechanical specifications of the boxed processor.

8.2.1 Boxed Processor Heatsink Dimensions (CEK)

The boxed processor will be shipped with an unattached thermal solution. Clearance is required

around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space

requirements and dimensions for the boxed processor and assembled heatsink are shown in Figure

20 through Figure 24. Figure 25 through Figure 26 are the mechanical drawings for the 4-pin server

board fan header and 4-pin connector used for the active CEK fan heatsink solution.

Figure 19. Passive Intel® Xeon™ Processor with 800 MHz System Bus Thermal Solution

(2U and larger)

Heat sink

Heat sink standoff

Heat sink screw

springs

Thermal Interface

Material

Heat sink

screws

Motherboard

and

processor

Chassis pan

Protective Tape

CEK spring

Heat sink

Heat sink standoff

Heat sink screw

springs

Thermal Interface

Material

Heat sink

screws

Motherboard

and

processor

Chassis pan

Protective Tape

CEK spring

1 2 ... 76 77 78 79 80 81 82 83 84 85 86 ... 95 96

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Fujitsu P4X-0036-2M-800L Datasheet Page 81

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