Fujitsu P4X-0036-2M-800L Datasheet download pdf (Page 79)

Intel® Xeon™ Processor with 800 MHz System Bus

Datasheet 79

8.0 Boxed Processor Specifications

8.1 Introduction

Intel boxed processors are intended for system integrators who build systems from components

available through distribution channels. The Intel® Xeon™ processor with 800 MHz system bus

will be offered as an Intel boxed processor.

Intel will offer boxed the Intel® Xeon™ processor with 800 MHz system bus with three product

configurations available for each processor frequency: 1U passive, 2U passive and 2U+ Active.

Although the active heatsink mechanically fits into a 2U keepout, additional design considerations

may need to be addressed to provide sufficient airflow to the fan inlet.

The active heatsink is primarily designed to be used in a pedestal chassis where sufficient air inlet

space is present and side directional airflow is not an issue. The 1U and 2U passive heatsinks

require the use of chassis ducting and are targeted for use in rack mount servers. The retention

solution used for these products is called the Common Enabling Kit, or CEK. The CEK base is

compatible with all three heatsink solutions.

The active heatsink solution for the boxed Intel® Xeon™ processor with 800 MHz system bus will

be transitioning after initial product introduction from a 3-pin thermistor controlled solution to a 4-

pin pulse width modulated (PWM)T-diode controlled solution. This transition is being done to help

customers meet acoustic targets in pedestal platforms, through the ability to directly control the

active heatsink fan RPM. To properly support this new active heatsink solution it may be necessary

to modify existing baseboard designs with 4-pin CPU fan headers. If a 4-pin active fan heatsink

solution is plugged into the older 3-pin fan header the heatsink will revert back to a thermistor

controlled mode. Please see the Section 8.3, “Electrical Requirements” on page 89 for more details.

Figure 16 through Figure 18 are representations of the three heatsink solutions that will be offered

as part of a boxed Intel® Xeon™ processor with 800 MHz system bus. Figure 19 shows an

exploded view of the boxed processor thermal solution for the Intel® Xeon™ processor with

800 MHz system bus and the other CEK retention components.

Figure 16. 1U Passive CEK Heatsink

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Fujitsu P4X-0036-2M-800L Datasheet Page 79